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Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Reballing

USD 65.99

0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Re-balling Stencil Plant Tin Steel Net With Fixed Plate and Holder EMMC / EMCP / UFS font chip types and models of many, and different models, different capacity, font thickness is different, this product is equipped with adjustable steel, simply change the different stencils can be very convenient tin, cost savings Reduce cumbersome. With Fixed Plate and Holder, Easy to use and more accurate IC welding position

6 in 1 Samsung BGA Reballing stencil

USD 41.4USD 39

6 in 1 BGA Reballing Stencil Very Useful for every Hardware Repairing lab supported many kind of ICs & CPU with 0.12 mm soldering ball . Supported Model by Stencil Number 1 CPU MCM8998 Samsung s8 Samsung S8+ Samsung Note 8 Samsung G9500 Samsung G955U Samsung N9500 Supported Model by Stencil Number 2 CPU MSM8996 Samsung S7 Samsung G9300 Samsung 9350 Samsung 9308 Samsung A5 Samsung S5 Samsung J7 Supported Model by Stencil Number 3 Exynos CPU 7420 Samsung S6 Samsung S6+ Samsung Note5 Samsung G9200 Samsung G9250 Samsung N9200 Supported Model by Stencil Number 4 Exynos CPU 3470 ,  Exynos CPU 7580 ,  Exynos CPU 7880 Samsung A520 Samsung A310 Samsung S5 mini Samsung A3 Samsung A5 Samsung S5 Samsung J7 Supported Model by Stencil Number 5 CPU MCM8976 Samsung A9 Samsung C9 Samsung A9000 Samsung A9100 Samsung C9000 Supported Model by Stencil Number 6 CPU MCM8916 , CPU MSM8953  B01-AB Samsung C7010 Samsung J610 Samsung C7 Samsung J3 Samsung J5 Samsung A5

6 in 1 BGA Reballing Stencil for BGA153 BGA169 BGA186 BGA221 EMCP EMMC

USD 7.9USD 5.9

6 in 1 Phone Motherboard BGA Reballing Stencil Template High Precision Stencil IC Chipset for BGA153 BGA169 BGA186 BGA221 BGA162 BGA254 EMCP EMMC Repair

 

  • 6 In 1 PCB Motherboard BGA Reballing Stencil Template IC Chipset For BGA153/BGA162/ BGA169/ BGA186/BGA221/BGA254 EMCP/EMMC Repair Tools
  • Designed with ventilation hole, are provided with holes for ventilation and heat dissipation to prevent any damages
  • High temperature resistant and top steel BGA Reballing Stencil Template is available for BGA 153/162/169/186/221 /254 EMCP/EMMC
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