0.15MM Full Set EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254 Re-balling Stencil Plant Tin Steel Net With Fixed Plate and Holder EMMC / EMCP / UFS font chip types and models of many, and different models, different capacity, font thickness is different, this product is equipped with adjustable steel, simply change the different stencils can be very convenient tin, cost savings Reduce cumbersome. With Fixed Plate and Holder, Easy to use and more accurate IC welding position

Category
BGA Reballing Tool
Weight
320