6 in 1 BGA Reballing Stencil Very Useful for every Hardware Repairing lab supported many kind of ICs & CPU with 0.12 mm soldering ball . Supported Model by Stencil Number 1 CPU MCM8998 Samsung s8 Samsung S8+ Samsung Note 8 Samsung G9500 Samsung G955U Samsung N9500 Supported Model by Stencil Number 2 CPU MSM8996 Samsung S7 Samsung G9300 Samsung 9350 Samsung 9308 Samsung A5 Samsung S5 Samsung J7 Supported Model by Stencil Number 3 Exynos CPU 7420 Samsung S6 Samsung S6+ Samsung Note5 Samsung G9200 Samsung G9250 Samsung N9200 Supported Model by Stencil Number 4 Exynos CPU 3470 ,  Exynos CPU 7580 ,  Exynos CPU 7880 Samsung A520 Samsung A310 Samsung S5 mini Samsung A3 Samsung A5 Samsung S5 Samsung J7 Supported Model by Stencil Number 5 CPU MCM8976 Samsung A9 Samsung C9 Samsung A9000 Samsung A9100 Samsung C9000 Supported Model by Stencil Number 6 CPU MCM8916 , CPU MSM8953  B01-AB Samsung C7010 Samsung J610 Samsung C7 Samsung J3 Samsung J5 Samsung A5

Category
BGA Reballing Tool
Weight
200