iPhone 8 CPU A11 Module BGA Reballing Stencil Black 3D

SKU: PL-00279

USD 7.99
iPhone 8 A11 CPU Reballing Stencil 3D

The 3D feature of the 3D Black stencil makes positioning your chip much easier and 100% accurate.  Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil https://youtu.be/UdwOsrwO7Lw

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iPhone 8 A11 CPU Reballing Stencil 3D

The 3D feature of the 3D Black stencil makes positioning your chip much easier and 100% accurate.  Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil https://youtu.be/UdwOsrwO7Lw

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